TREA

Koichiro Mukoyama

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Gold wire for bonding
    • Patent number 5,702,814
    • Issue date Dec 30, 1997
    • Tanaka Denshi Kogyo Kabushiki Kaisha
    • Shinichi Hanada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Gold wire for the bonding of a semiconductor device
    • Patent number 4,938,923
    • Issue date Jul 3, 1990
    • Takeshi Kujiraoka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Gold line for bonding semiconductor element
    • Patent number 4,775,512
    • Issue date Oct 4, 1988
    • Tanaka Denshi Kogyo Kabushiki Kaisha
    • Yasuo Fukui
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...