Koichiro NISHIZAWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,033,905
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding structure and substrate bonding method
- Patent number 11,244,874
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow sealed device and manufacturing method therefor
- Patent number 10,950,567
- Issue date Mar 16, 2021
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,854,523
- Issue date Dec 1, 2020
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a Pd-containing adhesion layer
- Patent number 10,304,730
- Issue date May 28, 2019
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 10,224,294
- Issue date Mar 5, 2019
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,020,246
- Issue date Jul 10, 2018
- Mitsubishi Electric Corporation
- Koichiro Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 9,922,836
- Issue date Mar 20, 2018
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a Pd-containing adhesion layer
- Patent number 9,887,131
- Issue date Feb 6, 2018
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 9,887,284
- Issue date Feb 6, 2018
- Mitsubishi Electric Corporation
- Shinsuke Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device including a hollow...
- Patent number 9,576,845
- Issue date Feb 21, 2017
- Mitsubishi Electric Corporation
- Kazuhiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,048,295
- Issue date Jun 2, 2015
- Mitsubishi Electric Corporation
- Daisuke Tsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,766,445
- Issue date Jul 1, 2014
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor man...
- Patent number 8,728,939
- Issue date May 20, 2014
- Mitsubishi Electric Corporation
- Kazuhiro Maeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 8,581,411
- Issue date Nov 12, 2013
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,158,507
- Issue date Apr 17, 2012
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312915
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326758
- Publication date Oct 12, 2023
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220044978
- Publication date Feb 10, 2022
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING STRUCTURE AND SUBSTRATE BONDING METHOD
- Publication number 20200365473
- Publication date Nov 19, 2020
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200185285
- Publication date Jun 11, 2020
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW SEALED DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200144210
- Publication date May 7, 2020
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180138132
- Publication date May 17, 2018
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A Pd-CONTAINING ADHESION LAYER
- Publication number 20180061706
- Publication date Mar 1, 2018
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170229380
- Publication date Aug 10, 2017
- Mitsubishi Electric Corporation
- Koichiro HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20170154777
- Publication date Jun 1, 2017
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20160351442
- Publication date Dec 1, 2016
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160042994
- Publication date Feb 11, 2016
- Mitsubishi Electric Corporation
- Kazuhiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20140117549
- Publication date May 1, 2014
- Mitsubishi Electric Corporation
- Daisuke Tsunami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035145
- Publication date Feb 6, 2014
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...
- Publication number 20130323910
- Publication date Dec 5, 2013
- Mitsubishi Electric Corporation
- Kazuhiro Maeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130093061
- Publication date Apr 18, 2013
- Mitsubishi Electric Corporation
- Takayuki HISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110195567
- Publication date Aug 11, 2011
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110042822
- Publication date Feb 24, 2011
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040016940
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS

Koichiro NISHIZAWA

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Substrate bonding structure and substrate bonding method

Hollow sealed device and manufacturing method therefor

Semiconductor device

Semiconductor device having a Pd-containing adhesion layer

Semiconductor device

Semiconductor device

Semiconductor device manufacturing method and semiconductor device

Semiconductor device having a Pd-containing adhesion layer

Semiconductor device

Method for manufacturing a semiconductor device including a hollow...

Method of manufacturing semiconductor device

Semiconductor device

Method for manufacturing semiconductor device and semiconductor man...

Semiconductor device

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE BONDING STRUCTURE AND SUBSTRATE BONDING METHOD

SEMICONDUCTOR DEVICE

HOLLOW SEALED DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A Pd-CONTAINING ADHESION LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device