Koichiro YASUDA

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Kariya-city, Aichi-pref., JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for manufacturing member having a through hole
- Patent number 10,967,458
- Issue date Apr 6, 2021
- Denso Corporation
- Hideaki Shirai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20240326174
- Publication date Oct 3, 2024
- DENSO CORPORATION
- Koichiro YASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20240326165
- Publication date Oct 3, 2024
- DENSO CORPORATION
- Koichiro Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION METHOD
- Publication number 20240316824
- Publication date Sep 26, 2024
- DENSO CORPORATION
- Koichiro Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WAFERS
- Publication number 20230115673
- Publication date Apr 13, 2023
- DENSO CORPORATION
- Bahman SOLTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR MANUFACTURING MEMBER HAVING A THROUGH HOLE
- Publication number 20190039178
- Publication date Feb 7, 2019
- Denso Corporation
- Hideaki SHIRAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR