TREA

Koji AKAZAWA

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Adhesion method, adhesion-structure, and adhesion kit
    • Patent number 11,649,379
    • Issue date May 16, 2023
    • Nitto Denko Corporation
    • Akiko Yoshida
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Adhesion method, adhesion-structure, and adhesion kit
    • Patent number 11,174,415
    • Issue date Nov 16, 2021
    • Nitto Denko Corporation
    • Akiko Yoshida
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Optical-semiconductor device
    • Patent number 9,190,584
    • Issue date Nov 17, 2015
    • Nitto Denko Corporation
    • Takashi Kondo
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Optical semiconductor device
    • Patent number 8,492,791
    • Issue date Jul 23, 2013
    • Nitto Denko Corporation
    • Takashi Ozaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Re-release adhesive and re-release adhesive sheet
    • Patent number 7,641,966
    • Issue date Jan 5, 2010
    • Nitto Denko Corporation
    • Kouichi Hashimoto
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Laminated sheet
    • Patent number 7,521,122
    • Issue date Apr 21, 2009
    • Nitto Denko Corporation
    • Hiroshi Noro
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dicing-die bonding film
    • Patent number 5,476,565
    • Issue date Dec 19, 1995
    • Nitto Denko Corporation
    • Yuzo Akada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dicing-die bonding film
    • Patent number 5,304,418
    • Issue date Apr 19, 1994
    • Nitto Denko Corporation
    • Yuzo Akada
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ADHESION METHOD, ADHESION-STRUCTURE, AND ADHESION KIT
    • Publication number 20210403759
    • Publication date Dec 30, 2021
    • Nitto Denko Corporation
    • Akiko YOSHIDA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    ELECTRICALLY DEBONDABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND A...
    • Publication number 20200002581
    • Publication date Jan 2, 2020
    • NITTO DENKO CORPORATION
    • Kaori AKAMATSU
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    ADHESION METHOD, ADHESION-STRUCTURE, AND ADHESION KIT
    • Publication number 20180327635
    • Publication date Nov 15, 2018
    • Nitto Denko Corporation
    • Akiko YOSHIDA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL
    • Publication number 20140106487
    • Publication date Apr 17, 2014
    • Nitto Denko Corporation
    • Kazuya FUJIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL-SEMICONDUCTOR DEVICE
    • Publication number 20140057374
    • Publication date Feb 27, 2014
    • Nitto Denko Corporation
    • Takashi KONDO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    OPTICAL SEMICONDUCTOR DEVICE
    • Publication number 20120153345
    • Publication date Jun 21, 2012
    • Nitto Denko Corporation
    • Takashi Ozaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL-SEMICONDUCTOR DEVICE
    • Publication number 20110186893
    • Publication date Aug 4, 2011
    • Nitto Denko Corporation
    • Takashi KONDO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION
    • Publication number 20110079929
    • Publication date Apr 7, 2011
    • Nitto Denko Corporation
    • Hirokazu MATSUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL
    • Publication number 20110079816
    • Publication date Apr 7, 2011
    • Nitto Denko Corporation
    • Kazuya FUJIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHEET FOR PHOTOSEMICONDUCTOR ENCAPSULATION
    • Publication number 20100209670
    • Publication date Aug 19, 2010
    • Nitto Denko Corporation
    • Ichiro SUEHIRO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Laminated sheet
    • Publication number 20050008873
    • Publication date Jan 13, 2005
    • Hiroshi Noro
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Re-release adhesive and re-release adhesive sheet
    • Publication number 20020091173
    • Publication date Jul 11, 2002
    • NITTO DENKO CORPORATION
    • Kouichi Hashimoto
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...