Koji ASANO

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 10,143,092
- Issue date Nov 27, 2018
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,955,591
- Issue date Apr 24, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,872,401
- Issue date Jan 16, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,831,163
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,433,097
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting base board having heat slug with slit...
- Patent number 6,232,558
- Issue date May 15, 2001
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160295692
- Publication date Oct 6, 2016
- IBIDEN CO., LTD.
- Koji ASANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160268189
- Publication date Sep 15, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160242293
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...
- Publication number 20160143134
- Publication date May 19, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021753
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007468
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007451
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150319842
- Publication date Nov 5, 2015
- IBIDEN CO., LTD.
- Koji ASANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Electronic component mounting base board having heat slug with slit...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME