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KAWASAKI-SHI, JP
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device with copper wiring and its manufacture method
Patent number
6,440,844
Issue date
Aug 27, 2002
Fujitsu Limited
Hideo Takagi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE WITH COPPER WIRING AND ITS MANUFACTURE METHOD
Publication number
20020027287
Publication date
Mar 7, 2002
FUJITSU LIMITED
HIDEO TAKAGI
H01 - BASIC ELECTRIC ELEMENTS