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Koji Futatsumori
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Shah Alam, MY
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last 30 patents
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Epoxy resin compositions and semiconductor devices encapsulated the...
Patent number
5,994,785
Issue date
Nov 30, 1999
Mitsubishi Denki Kabushiki Kaisha
Noriaki Higuchi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...