Koji HARA

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including semiconductor chips stacked via rela...
- Patent number 9,508,670
- Issue date Nov 29, 2016
- Shinko Electric Industries Co., Ltd.
- Koji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic component package
- Patent number 9,374,889
- Issue date Jun 21, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,006,894
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150130053
- Publication date May 14, 2015
- Shinko Electric Industries Co., Ltd.
- Koji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20140293564
- Publication date Oct 2, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140264417
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140151891
- Publication date Jun 5, 2014
- Shinko Electric Industries Co., Ltd.
- Akihito TAKANO
- H01 - BASIC ELECTRIC ELEMENTS