Koji Honna

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Kawasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor having through hole
- Patent number 6,291,895
- Issue date Sep 18, 2001
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and method of manufacturing semic...
- Patent number 6,166,433
- Issue date Dec 26, 2000
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor having through hole
- Patent number 5,953,592
- Issue date Sep 14, 1999
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating semiconductor having through hole
- Publication number 20010028101
- Publication date Oct 11, 2001
- FUJITSU LIMITED
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS