Koji Hosaka

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Kumagaya, JP

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Patents Applicationslast 30 patents

Information Patent Application
Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method
- Publication number 20130014881
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Shingo FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biaxial Drive Mechanism and Die Bonder
- Publication number 20130014904
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Koji Hosaka
- H01 - BASIC ELECTRIC ELEMENTS