Koji Kitagawa

Person

Nishishirakawa-gun Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire saw apparatus
- Patent number 10,589,446
- Issue date Mar 17, 2020
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 10,518,380
- Issue date Dec 31, 2019
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slurry and method for producing slurry
- Patent number 9,260,643
- Issue date Feb 16, 2016
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for resuming operation of wire saw and wire saw
- Patent number 9,079,332
- Issue date Jul 14, 2015
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slicing method and wire saw apparatus
- Patent number 8,567,384
- Issue date Oct 29, 2013
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Polishing apparatus
- Patent number 8,454,410
- Issue date Jun 4, 2013
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw apparatus
- Patent number 8,434,468
- Issue date May 7, 2013
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, polishing apparatus and method for demounting workp...
- Patent number 8,323,075
- Issue date Dec 4, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Slicing method and a wire saw apparatus
- Patent number 8,267,742
- Issue date Sep 18, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing workpiece
- Patent number 8,146,581
- Issue date Apr 3, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 8,092,281
- Issue date Jan 10, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing workpiece by using wire saw and wire saw
- Patent number 8,037,878
- Issue date Oct 18, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing workpiece by using wire saw and wire saw
- Patent number 7,959,491
- Issue date Jun 14, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon single crystal wafer and method for manufacturing the same
- Patent number 6,893,499
- Issue date May 17, 2005
- Shin-Etsu Handotai Co., Ltd.
- Izumi Fusegawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for growing single crystal, method for producing single c...
- Patent number 6,632,280
- Issue date Oct 14, 2003
- Shin-Etsu Handotai Co., Ltd.
- Ryoji Hoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing silicon single crystal
- Patent number 6,506,251
- Issue date Jan 14, 2003
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20210016413
- Publication date Jan 21, 2021
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20180281147
- Publication date Oct 4, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SAW APPARATUS
- Publication number 20180079108
- Publication date Mar 22, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SLURRY AND METHOD FOR PRODUCING SLURRY
- Publication number 20150000208
- Publication date Jan 1, 2015
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW
- Publication number 20140000580
- Publication date Jan 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW
- Publication number 20110088678
- Publication date Apr 21, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE
- Publication number 20110059679
- Publication date Mar 10, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW
- Publication number 20100258103
- Publication date Oct 14, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW
- Publication number 20100252017
- Publication date Oct 7, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS AND METHOD FOR DEMOUNTING WORKP...
- Publication number 20100233945
- Publication date Sep 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
WIRE SAW APPARATUS
- Publication number 20100206285
- Publication date Aug 19, 2010
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20100210192
- Publication date Aug 19, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
SLICING METHOD AND A WIRE SAW APPARATUS
- Publication number 20100163010
- Publication date Jul 1, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
POLISHING APPARATUS
- Publication number 20100144249
- Publication date Jun 10, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Application
SLICING METHOD AND WIRE SAW APPARATUS
- Publication number 20100089377
- Publication date Apr 15, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Polishing head and polishing apparatus
- Publication number 20090291623
- Publication date Nov 26, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Silicon single crystal wafer and method for manufacturing the same
- Publication number 20030106484
- Publication date Jun 12, 2003
- Izumi Fusegawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Apparatas For Growing Jingle Crystal, Method For Producing Jingle C...
- Publication number 20030070605
- Publication date Apr 17, 2003
- Ryoji Hoshi
- C30 - CRYSTAL GROWTH

Koji Kitagawa

Person

Patents Grantslast 30 patents

Method for slicing workpiece and wire saw

Wire saw apparatus

Method for slicing workpiece and wire saw

Slurry and method for producing slurry

Method for resuming operation of wire saw and wire saw

Slicing method and wire saw apparatus

Polishing apparatus

Wire saw apparatus

Polishing head, polishing apparatus and method for demounting workp...

Slicing method and a wire saw apparatus

Method for slicing workpiece

Polishing head and polishing apparatus

Method for slicing workpiece by using wire saw and wire saw

Method for slicing workpiece by using wire saw and wire saw

Silicon single crystal wafer and method for manufacturing the same

Apparatus for growing single crystal, method for producing single c...

Method for producing silicon single crystal

Patents Applicationslast 30 patents

METHOD FOR SLICING WORKPIECE AND WIRE SAW

METHOD FOR SLICING WORKPIECE AND WIRE SAW

WIRE SAW APPARATUS

SLURRY AND METHOD FOR PRODUCING SLURRY

METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW

METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW

METHOD FOR SLICING WORKPIECE

METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW

METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW

POLISHING HEAD, POLISHING APPARATUS AND METHOD FOR DEMOUNTING WORKP...

WIRE SAW APPARATUS

POLISHING HEAD AND POLISHING APPARATUS

SLICING METHOD AND A WIRE SAW APPARATUS

POLISHING APPARATUS

SLICING METHOD AND WIRE SAW APPARATUS

Polishing head and polishing apparatus

Silicon single crystal wafer and method for manufacturing the same

Apparatas For Growing Jingle Crystal, Method For Producing Jingle C...