Koji MURAKAMI

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling device
- Patent number 12,158,313
- Issue date Dec 3, 2024
- Nidec Corporation
- Kazuhiro Nishikawa
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20250210445
- Publication date Jun 26, 2025
- NIDEC CORPORATION
- Yuki YANAGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR MODULE
- Publication number 20250191992
- Publication date Jun 12, 2025
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20230335463
- Publication date Oct 19, 2023
- NIDEC CORPORATION
- Yuki YANAGITA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING MEMBER
- Publication number 20230328921
- Publication date Oct 12, 2023
- NIDEC CORPORATION
- Hong Long CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20230307319
- Publication date Sep 28, 2023
- NIDEC CORPORATION
- Koji MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND COOLING DEVICE
- Publication number 20230204305
- Publication date Jun 29, 2023
- NIDEC CORPORATION
- Yuta HORI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE
- Publication number 20230077047
- Publication date Mar 9, 2023
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING JACKET AND COOLING DEVICE
- Publication number 20230044486
- Publication date Feb 9, 2023
- NIDEC CORPORATION
- Masaaki HANANO
- F28 - HEAT EXCHANGE IN GENERAL

Koji MURAKAMI

Person

Patents Grantslast 30 patents

Cooling device

Patents Applicationslast 30 patents

HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE

COOLING DEVICE, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR MODULE

HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE

COOLING MEMBER

HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE

HEAT DISSIPATION MEMBER AND COOLING DEVICE

COOLING DEVICE

LIQUID COOLING JACKET AND COOLING DEVICE