Koji Okada

Person

Ohtsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polyimide precursor composition and use thereof
- Patent number 9,267,004
- Issue date Feb 23, 2016
- Kaneka Corporation
- Koji Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, multilayer body using same, and ci...
- Patent number 8,501,874
- Issue date Aug 6, 2013
- Kaneka Corporation
- Shigeru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clear and flame retardant polycarbonate resin film
- Patent number 8,426,015
- Issue date Apr 23, 2013
- Styron Europe GmbH
- Kazushi Horisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Phosphazene compound, photosensitive resin composition and use thereof
- Patent number 8,063,245
- Issue date Nov 22, 2011
- Kaneka Corporation
- Koji Okada
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Flame retardant and light diffusing polycarbonate resin composition...
- Patent number 7,960,450
- Issue date Jun 14, 2011
- Styron Europe GmbH
- Akihito Kawagoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, multilayer body using same, and ci...
- Patent number 7,521,511
- Issue date Apr 21, 2009
- Kaneka Corporation
- Shigeru Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Diamine, acid dianhydride, and reactive group containing polyimide...
- Patent number 7,396,898
- Issue date Jul 8, 2008
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide precursor, manufacturing method thereof, and resin compos...
- Patent number 7,189,488
- Issue date Mar 13, 2007
- Kaneka Corporation
- Toshio Yamanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition and photosensitive films and lamin...
- Patent number 7,141,614
- Issue date Nov 28, 2006
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Diamine novel acid dianhydride and novel polyimide composition form...
- Patent number 7,019,104
- Issue date Mar 28, 2006
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing polyimide resin
- Patent number 6,790,930
- Issue date Sep 14, 2004
- Kaneka Corporation
- Takeshi Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Acid anhydrides
- Patent number 6,642,393
- Issue date Nov 4, 2003
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy-modified polyimide, photosensitive composition, coverlay film...
- Patent number 6,605,353
- Issue date Aug 12, 2003
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide compositions and novel acid dianhydrides to be used therein
- Patent number 6,350,845
- Issue date Feb 26, 2002
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process of aldol condensation by gas-phase reaction
- Patent number 5,334,770
- Issue date Aug 2, 1994
- Sumitomo Chemical Company, Limited
- Hiroshi Ueda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyimide resin film and method of making said film
- Patent number 5,300,619
- Issue date Apr 5, 1994
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Koji Okada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tetracarboxylic acid dianhydrides
- Patent number 5,122,617
- Issue date Jun 16, 1992
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Koji Okada
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
- Publication number 20110083884
- Publication date Apr 14, 2011
- KANEKA CORPORATION
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF...
- Publication number 20100218984
- Publication date Sep 2, 2010
- Toshio Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Diffusing Thermoplastic Resin Composition and Light Diffusion...
- Publication number 20100148136
- Publication date Jun 17, 2010
- Akihito Kawagoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CLEAR AND FLAME RETARDANT POLYCARBONATE RESIN FILM
- Publication number 20100151221
- Publication date Jun 17, 2010
- Kuzushi Horisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flame Retardant Polycarbonate Resin Composition
- Publication number 20100144939
- Publication date Jun 10, 2010
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flame retardant and light diffusing polycarbonate resin composition...
- Publication number 20090326120
- Publication date Dec 31, 2009
- SUMITOMO DOW LIMITED
- Akihito Kawagoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting Resin Composition, Multilayer Body Using Same, and Ci...
- Publication number 20080306220
- Publication date Dec 11, 2008
- KANEKA CORPORATION
- Shigeru Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition, multilayer body using same, and ci...
- Publication number 20060205891
- Publication date Sep 14, 2006
- Shigeru Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition capable of being developed with aq...
- Publication number 20060199920
- Publication date Sep 7, 2006
- Koji Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Phosphazene compound, photosensitive resin composition and use thereof
- Publication number 20060142542
- Publication date Jun 29, 2006
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition and photosensitive films and lamin...
- Publication number 20040265731
- Publication date Dec 30, 2004
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition and photosensitive dry film resist...
- Publication number 20040235992
- Publication date Nov 25, 2004
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Diamine, acid dianhydride, polymide composition having reactive gro...
- Publication number 20040158030
- Publication date Aug 12, 2004
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition, solder resist comprising the same...
- Publication number 20040048978
- Publication date Mar 11, 2004
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide precursor, manufacturing method thereof, and resin compos...
- Publication number 20030149142
- Publication date Aug 7, 2003
- Kaneka Corporation
- Toshio Yamanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel polyimide compositions and novel acid dianhydrides to be used...
- Publication number 20020055610
- Publication date May 9, 2002
- Kaneka Corporation
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy-modified polyimide, photosensitive composition, coverlay film...
- Publication number 20010056174
- Publication date Dec 27, 2001
- Koji Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Polyimide precursor composition and use thereof

Thermosetting resin composition, multilayer body using same, and ci...

Clear and flame retardant polycarbonate resin film

Phosphazene compound, photosensitive resin composition and use thereof

Flame retardant and light diffusing polycarbonate resin composition...

Thermosetting resin composition, multilayer body using same, and ci...

Diamine, acid dianhydride, and reactive group containing polyimide...

Polyimide precursor, manufacturing method thereof, and resin compos...

Photosensitive resin composition and photosensitive films and lamin...

Diamine novel acid dianhydride and novel polyimide composition form...

Process for producing polyimide resin

Acid anhydrides

Epoxy-modified polyimide, photosensitive composition, coverlay film...

Polyimide compositions and novel acid dianhydrides to be used therein

Process of aldol condensation by gas-phase reaction

Polyimide resin film and method of making said film

Tetracarboxylic acid dianhydrides

Patents Applicationslast 30 patents

NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF

PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF...

Light Diffusing Thermoplastic Resin Composition and Light Diffusion...

CLEAR AND FLAME RETARDANT POLYCARBONATE RESIN FILM

Flame Retardant Polycarbonate Resin Composition

Flame retardant and light diffusing polycarbonate resin composition...

Thermosetting Resin Composition, Multilayer Body Using Same, and Ci...

Thermosetting resin composition, multilayer body using same, and ci...

Photosensitive resin composition capable of being developed with aq...

Phosphazene compound, photosensitive resin composition and use thereof

Photosensitive resin composition and photosensitive films and lamin...

Photosensitive resin composition and photosensitive dry film resist...

Diamine, acid dianhydride, polymide composition having reactive gro...

Photosensitive resin composition, solder resist comprising the same...

Polyimide precursor, manufacturing method thereof, and resin compos...

Novel polyimide compositions and novel acid dianhydrides to be used...

Epoxy-modified polyimide, photosensitive composition, coverlay film...