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Koji Okuda

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Patents Grantslast 30 patents

  • Information Patent Grant

    Plasma processing apparatus and method
    • Patent number 8,795,467
    • Issue date Aug 5, 2014
    • Hitachi High-Technologies Corporation
    • Ryoji Nishio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plasma processing apparatus and method
    • Patent number 8,062,473
    • Issue date Nov 22, 2011
    • Hitachi High-Technologies Corporation
    • Ryoji Nishio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plasma processing method
    • Patent number 7,833,429
    • Issue date Nov 16, 2010
    • Hitachi High-Technologies Corporation
    • Ryoji Nishio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plasma processing apparatus and method
    • Patent number 7,740,739
    • Issue date Jun 22, 2010
    • Hitachi High-Technologies Corporation
    • Ryoji Nishio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,138,606
    • Issue date Nov 21, 2006
    • Hitachi High-Technologies Corporation
    • Seiichiro Kanno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer stage for wafer processing apparatus
    • Patent number 6,895,179
    • Issue date May 17, 2005
    • Hitachi High-Technologies Corporation
    • Seiichiro Kanno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer stage for wafer processing apparatus and wafer processing method
    • Patent number 6,646,233
    • Issue date Nov 11, 2003
    • Hitachi High-Technologies Corporation
    • Seiichiro Kanno
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents