Koji Soejima

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 9,847,325
- Issue date Dec 19, 2017
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,524,953
- Issue date Dec 20, 2016
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,406,602
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,975,750
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 8,823,174
- Issue date Sep 2, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,685,796
- Issue date Apr 1, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,633,591
- Issue date Jan 21, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,456,019
- Issue date Jun 4, 2013
- Renesas Electronics Corporation
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stacking semiconductor chips including forming an interco...
- Patent number 8,395,269
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,354,340
- Issue date Jan 15, 2013
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,304,915
- Issue date Nov 6, 2012
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,183,685
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,114,766
- Issue date Feb 14, 2012
- Renesas Electronics Corporation
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through electrode and method of manu...
- Patent number 8,102,049
- Issue date Jan 24, 2012
- Renesas Electronics Corporation
- Nobuaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,058,165
- Issue date Nov 15, 2011
- Renesas Electronics Corporation
- Masaya Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing the...
- Patent number 8,050,050
- Issue date Nov 1, 2011
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered wiring board, semiconductor device in which multilayer...
- Patent number 8,039,756
- Issue date Oct 18, 2011
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,035,231
- Issue date Oct 11, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,201
- Issue date Oct 4, 2011
- Renesas Electronics Corporation
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 7,928,001
- Issue date Apr 19, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal interconnect layers for flip chip device
- Patent number 7,927,999
- Issue date Apr 19, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,892,973
- Issue date Feb 22, 2011
- Renesas Electronics Corporation
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing the...
- Patent number 7,889,514
- Issue date Feb 15, 2011
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device in which wiring board is used, a...
- Patent number 7,880,295
- Issue date Feb 1, 2011
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,800,233
- Issue date Sep 21, 2010
- NEC Electronics Corporation
- Masaya Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device in which wiring board is used, a...
- Patent number 7,791,186
- Issue date Sep 7, 2010
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit chip, and electronic circuit device and method f...
- Patent number 7,759,786
- Issue date Jul 20, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190139953
- Publication date May 9, 2019
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180019237
- Publication date Jan 18, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170236810
- Publication date Aug 17, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20160307875
- Publication date Oct 20, 2016
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20150137348
- Publication date May 21, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140346681
- Publication date Nov 27, 2014
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140103524
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130099390
- Publication date Apr 25, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120211872
- Publication date Aug 23, 2012
- RENESAS ELECTRONICS CORPORATION
- Masaya KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH EL...
- Publication number 20120100715
- Publication date Apr 26, 2012
- RENESAS ELECTRONICS CORPORATION
- Nobuaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20110147058
- Publication date Jun 23, 2011
- RENESAS ELECTRONICS CORPORATION
- Masaya KAWANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110121445
- Publication date May 26, 2011
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110101541
- Publication date May 5, 2011
- RENESAS ELECTRONICS CORPORATION
- Masaya KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE...
- Publication number 20110075389
- Publication date Mar 31, 2011
- NEC Corporation
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100297811
- Publication date Nov 25, 2010
- NEC ELECTRONICS CORPORATION
- Masaya Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100144091
- Publication date Jun 10, 2010
- NEC Electronics Corporation
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOAD, SEMICONDUCTOR DEVICE IN WHICH WIRING BOARD IS USED, AN...
- Publication number 20100127405
- Publication date May 27, 2010
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100087058
- Publication date Apr 8, 2010
- NEC ELECTRONICS CORPORATION
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20100048019
- Publication date Feb 25, 2010
- NEC ELECTRONICS CORPORATION
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING AN INTERCONNECTION STRUCTURE
- Publication number 20090273092
- Publication date Nov 5, 2009
- NEC ELECTRONICS CORPORATION
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080203565
- Publication date Aug 28, 2008
- NEC ELECTRONICS CORPORATION
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080136020
- Publication date Jun 12, 2008
- NEC ELECTRONICS CORPORATION
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including microstrip line and coplanar line
- Publication number 20080128916
- Publication date Jun 5, 2008
- NEC Electronics Corporation
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080079164
- Publication date Apr 3, 2008
- NEC ELECTRONICS CORPORATION
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080079163
- Publication date Apr 3, 2008
- NEC ELECTRONICS CORPORATION
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080079157
- Publication date Apr 3, 2008
- NEC Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND METHOD OF MANU...
- Publication number 20080048337
- Publication date Feb 28, 2008
- NEC ELECTRONICS CORPORATION
- Nobuaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070158837
- Publication date Jul 12, 2007
- NEC Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070126085
- Publication date Jun 7, 2007
- NEC ELECTRONICS CORPORATION
- Masaya Kawano
- H01 - BASIC ELECTRIC ELEMENTS

Koji Soejima

Person

Patents Grantslast 30 patents

Electronic device

Electronic device

Electronic device

Electronic device

Electronic device

Electronic device

Electronic device

Electronic device

Electronic device and method of manufacturing the same

Electronic device

Semiconductor device

Method of stacking semiconductor chips including forming an interco...

Electronic device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Method for manufacturing semiconductor device

Semiconductor device including through electrode and method of manu...

Semiconductor device and method of manufacturing the same

Wiring board, semiconductor device, and method of manufacturing the...

Multilayered wiring board, semiconductor device in which multilayer...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Electronic device and method of manufacturing the same

Method of forming metal interconnect layers for flip chip device

Method for manufacturing a semiconductor device

Wiring board, semiconductor device, and method of manufacturing the...

Wiring board, semiconductor device in which wiring board is used, a...

Semiconductor device and method of manufacturing the same

Wiring board, semiconductor device in which wiring board is used, a...

Electronic circuit chip, and electronic circuit device and method f...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH EL...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

WIRING BOAD, SEMICONDUCTOR DEVICE IN WHICH WIRING BOARD IS USED, AN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE HAVING AN INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device including microstrip line and coplanar line

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND METHOD OF MANU...

Semiconductor device

Semiconductor device and method of manufacturing the same