Koji Takeuchi

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Nukata-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonded wire based to electronic part...
- Patent number 6,731,001
- Issue date May 4, 2004
- Denso Corporation
- Kan Kinouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device including bonding wire bonded to electronic pa...
- Publication number 20020020910
- Publication date Feb 21, 2002
- Kan Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS