Koji Tatsumi

Person

Sanda-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Tin alloy plating solution
- Patent number 11,879,182
- Issue date Jan 23, 2024
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-concentration tin sulfonate aqueous solution and method for pr...
- Patent number 11,692,277
- Issue date Jul 4, 2023
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-concentration tin sulfonate aqueous solution and method for pr...
- Patent number 11,525,187
- Issue date Dec 13, 2022
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin alloy plating solution
- Patent number 11,060,200
- Issue date Jul 13, 2021
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Tin or tin alloy plating solution and bump forming method
- Patent number 11,053,600
- Issue date Jul 6, 2021
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
SnAg alloy plating solution
- Patent number 10,612,150
- Issue date Apr 7, 2020
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
DITHIAPOLYETHER DIOL, METHOD FOR PRODUCING SAME, SNAG PLATING SOLUT...
- Publication number 20240116861
- Publication date Apr 11, 2024
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN ALLOY PLATING SOLUTION
- Publication number 20240060204
- Publication date Feb 22, 2024
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN ALLOY PLATING SOLUTION
- Publication number 20230323554
- Publication date Oct 12, 2023
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLASMA-RESISTANT COATING FILM, SOL GEL LIQUID FOR FORMING SAID FILM...
- Publication number 20230313381
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Naoto Tsujiuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...
- Publication number 20230038219
- Publication date Feb 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...
- Publication number 20220333264
- Publication date Oct 20, 2022
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...
- Publication number 20220042196
- Publication date Feb 10, 2022
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN ALLOY PLATING SOLUTION
- Publication number 20210140060
- Publication date May 13, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C07 - ORGANIC CHEMISTRY
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION AND BUMP FORMING METHOD
- Publication number 20210025069
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SnAg ALLOY PLATING SOLUTION
- Publication number 20190338433
- Publication date Nov 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Koji Tatsumi

Person

Patents Grantslast 30 patents

Tin alloy plating solution

High-concentration tin sulfonate aqueous solution and method for pr...

High-concentration tin sulfonate aqueous solution and method for pr...

Tin alloy plating solution

Tin or tin alloy plating solution and bump forming method

SnAg alloy plating solution

Patents Applicationslast 30 patents

DITHIAPOLYETHER DIOL, METHOD FOR PRODUCING SAME, SNAG PLATING SOLUT...

TIN ALLOY PLATING SOLUTION

TIN ALLOY PLATING SOLUTION

PLASMA-RESISTANT COATING FILM, SOL GEL LIQUID FOR FORMING SAID FILM...

TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...

HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...

HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...

TIN ALLOY PLATING SOLUTION

TIN OR TIN ALLOY PLATING SOLUTION AND BUMP FORMING METHOD

SnAg ALLOY PLATING SOLUTION