Koji TAYA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Structures and methods for stack type semiconductor packaging
- Patent number 9,418,940
- Issue date Aug 16, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,293,441
- Issue date Mar 22, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 9,142,440
- Issue date Sep 22, 2015
- Cypess Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,900,928
- Issue date Dec 2, 2014
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip bonded semiconductor device with shelf
- Patent number 8,796,864
- Issue date Aug 5, 2014
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,772,953
- Issue date Jul 8, 2014
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,530,282
- Issue date Sep 10, 2013
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip bonded semiconductor device with shelf and method of manu...
- Patent number 8,486,756
- Issue date Jul 16, 2013
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a simplified stack and method for manuf...
- Patent number 8,361,857
- Issue date Jan 29, 2013
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to manufacture thereof
- Patent number 8,148,771
- Issue date Apr 3, 2012
- Spansion LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a simplified stack and method for manuf...
- Patent number 8,097,961
- Issue date Jan 17, 2012
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,179
- Issue date Oct 4, 2011
- Spansion, LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,968,990
- Issue date Jun 28, 2011
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,846,771
- Issue date Dec 7, 2010
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and programming method
- Patent number 7,834,470
- Issue date Nov 16, 2010
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 7,786,587
- Issue date Aug 31, 2010
- Spansion LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type semiconductor device and method of fabricating stacked...
- Patent number 7,696,616
- Issue date Apr 13, 2010
- Spansion LLC
- Yasuhiro Shinma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,642,637
- Issue date Jan 5, 2010
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,605,457
- Issue date Oct 20, 2009
- Spansion LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and programming method
- Patent number 7,566,978
- Issue date Jul 28, 2009
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 7,489,029
- Issue date Feb 10, 2009
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,414,305
- Issue date Aug 19, 2008
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,285,848
- Issue date Oct 23, 2007
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20140035170
- Publication date Feb 6, 2014
- SPANSION LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130277834
- Publication date Oct 24, 2013
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...
- Publication number 20120083096
- Publication date Apr 5, 2012
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120025364
- Publication date Feb 2, 2012
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20110024922
- Publication date Feb 3, 2011
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD TO MANUFACTURE THEREOF
- Publication number 20100276801
- Publication date Nov 4, 2010
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...
- Publication number 20090321958
- Publication date Dec 31, 2009
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090325346
- Publication date Dec 31, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20090256250
- Publication date Oct 15, 2009
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTGURING THERE OF
- Publication number 20090200684
- Publication date Aug 13, 2009
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20090174057
- Publication date Jul 9, 2009
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING
- Publication number 20090115044
- Publication date May 7, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Structure for stacked-type semiconductor device, method of...
- Publication number 20090093085
- Publication date Apr 9, 2009
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing thereof
- Publication number 20090008747
- Publication date Jan 8, 2009
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICA...
- Publication number 20080274591
- Publication date Nov 6, 2008
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20080169544
- Publication date Jul 17, 2008
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and programming method
- Publication number 20080169552
- Publication date Jul 17, 2008
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20070290320
- Publication date Dec 20, 2007
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070145579
- Publication date Jun 28, 2007
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20060245908
- Publication date Nov 2, 2006
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked type semiconductor device and method of fabricating stacked...
- Publication number 20060170090
- Publication date Aug 3, 2006
- Spansion LLC
- Yasuhiro Shinma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier structure for stacked-type semiconductor device, method of...
- Publication number 20060043600
- Publication date Mar 2, 2006
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20050269682
- Publication date Dec 8, 2005
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Structures and methods for stack type semiconductor packaging

Semiconductor device and method of manufacturing the same

Carrier structure for stacked-type semiconductor device, method of...

Semiconductor device and programming method

Flip chip bonded semiconductor device with shelf

Semiconductor device and programming method

Semiconductor device and programming method

Flip chip bonded semiconductor device with shelf and method of manu...

Semiconductor device having a simplified stack and method for manuf...

Semiconductor device and method to manufacture thereof

Semiconductor device having a simplified stack and method for manuf...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Carrier for stacked type semiconductor device and method of fabrica...

Semiconductor device and programming method

Semiconductor device and method for manufacturing thereof

Stacked type semiconductor device and method of fabricating stacked...

Carrier for stacked type semiconductor device and method of fabrica...

Semiconductor device and method of manufacturing the same

Semiconductor device and programming method

Carrier structure for stacked-type semiconductor device, method of...

Carrier for stacked type semiconductor device and method of fabrica...

Carrier for stacked type semiconductor device and method of fabrica...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

SEMICONDUCTOR DEVICE AND METHOD TO MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTGURING THERE OF

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING

Carrier Structure for stacked-type semiconductor device, method of...

Semiconductor device and method for manufacturing thereof

CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICA...

Semiconductor device and method of fabricating the same

Semiconductor device and programming method

Carrier for stacked type semiconductor device and method of fabrica...

Semiconductor device and method of manufacturing the same

Carrier for stacked type semiconductor device and method of fabrica...

Stacked type semiconductor device and method of fabricating stacked...

Carrier structure for stacked-type semiconductor device, method of...

Carrier for stacked type semiconductor device and method of fabrica...