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Koji Temba
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Soraku-gun, JP
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Patents Grants
last 30 patents
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Patent Grant
Wiring board and manufacturing method therefor
Patent number
7,516,542
Issue date
Apr 14, 2009
JTEKT Corporation
Koji Temba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Wiring board and manufacturing method therefor
Publication number
20060091544
Publication date
May 4, 2006
KOYO SEIKO CO., LTD.
Koji Temba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR