Koji Tomita

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Hitachinaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Processing instrument and processing instrument system
- Patent number 7,594,175
- Issue date Sep 22, 2009
- Hitach High-Technologies Corporation
- Koji Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Defect inspection method and apparatus for silicon wafer
- Patent number 6,683,683
- Issue date Jan 27, 2004
- Hitachi, Ltd.
- Koji Tomita
- G01 - MEASURING TESTING
Information Patent Grant
Defect inspection method and apparatus for silicon wafer
- Patent number 6,384,909
- Issue date May 7, 2002
- Hitachi, Ltd.
- Koji Tomita
- G01 - MEASURING TESTING
Information Patent Grant
Defect inspection apparatus for silicon wafer
- Patent number 6,256,092
- Issue date Jul 3, 2001
- Hitachi, Ltd.
- Koji Tomita
- G01 - MEASURING TESTING
Information Patent Grant
Defect inspection apparatus for silicon wafer
- Patent number 6,157,444
- Issue date Dec 5, 2000
- Hitachi, Ltd.
- Koji Tomita
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Processing instrument and processing instrument system
- Publication number 20060221096
- Publication date Oct 5, 2006
- Koji Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Defect inspection method and apparatus for silicon wafer
- Publication number 20020080344
- Publication date Jun 27, 2002
- Koji Tomita
- G01 - MEASURING TESTING
Information Patent Application
Defect inspection method and apparatus for silicon wafer
- Publication number 20010015802
- Publication date Aug 23, 2001
- Koji Tomita
- G01 - MEASURING TESTING