Koji Watanabe

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board, and electronic device
- Patent number 11,647,584
- Issue date May 9, 2023
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plurality of leads having a two stage recess
- Patent number 11,616,005
- Issue date Mar 28, 2023
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with multi-layer resin structure and semiconductor device...
- Patent number 10,943,857
- Issue date Mar 9, 2021
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing lead frame
- Patent number 10,381,292
- Issue date Aug 13, 2019
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME, AND SEMICONDUCTOR DEVICE
- Publication number 20220375831
- Publication date Nov 24, 2022
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20220159831
- Publication date May 19, 2022
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LEA...
- Publication number 20210249340
- Publication date Aug 12, 2021
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR ELEMENTS AND SEMICONDUCTOR DEVICE
- Publication number 20190088578
- Publication date Mar 21, 2019
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20190074242
- Publication date Mar 7, 2019
- Shinko Electric Industries Co., Ltd.
- Koji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...
- Publication number 20170162520
- Publication date Jun 8, 2017
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS

Koji Watanabe

Person

Patents Grantslast 30 patents

Circuit board, and electronic device

Plurality of leads having a two stage recess

Substrate with multi-layer resin structure and semiconductor device...

Lead frame and method of manufacturing lead frame

Patents Applicationslast 30 patents

LEAD FRAME, AND SEMICONDUCTOR DEVICE

CIRCUIT BOARD, AND ELECTRONIC DEVICE

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LEA...

SUBSTRATE FOR SEMICONDUCTOR ELEMENTS AND SEMICONDUCTOR DEVICE

LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME

LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...