Koji YOSHITSUGU

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a diamond substrate and method of ma...
- Patent number 11,482,464
- Issue date Oct 25, 2022
- Mitsubishi Electric Corporation
- Koji Yoshitsugu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,282,950
- Issue date Mar 22, 2022
- Mitsubishi Electric Corporation
- Takuma Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor manufacturing...
- Patent number 11,107,685
- Issue date Aug 31, 2021
- Mitsubishi Electric Corporation
- Keisuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...
- Publication number 20240258195
- Publication date Aug 1, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hideaki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220416031
- Publication date Dec 29, 2022
- Mitsubishi Electric Corporation
- Koji YOSHITSUGU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20220148941
- Publication date May 12, 2022
- Mitsubishi Electric Corporation
- Koji YOSHITSUGU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210043539
- Publication date Feb 11, 2021
- Mitsubishi Electric Corporation
- Koji YOSHITSUGU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200135908
- Publication date Apr 30, 2020
- Mitsubishi Electric Corporation
- Takuma NANJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20190362974
- Publication date Nov 28, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Keisuke NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Koji YOSHITSUGU

Person

Patents Grantslast 30 patents

Semiconductor device including a diamond substrate and method of ma...

Method for manufacturing semiconductor device

Semiconductor manufacturing method and semiconductor manufacturing...

Patents Applicationslast 30 patents

BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...