Kojiro Kameyama

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device with through hole
- Patent number 9,165,898
- Issue date Oct 20, 2015
- Semiconductor Components Industries, LLC
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure and semiconductor device
- Patent number 8,154,129
- Issue date Apr 10, 2012
- Sanyo Semiconductor Co., Ltd.
- Kikuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device with a peeling preve...
- Patent number 7,906,430
- Issue date Mar 15, 2011
- Sanyo Electric Co., LTD
- Mitsuo Umemoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,820,548
- Issue date Oct 26, 2010
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device with a barrier layer a...
- Patent number 7,759,247
- Issue date Jul 20, 2010
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,670,955
- Issue date Mar 2, 2010
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,659,576
- Issue date Feb 9, 2010
- Sanyo Electric Co., Ltd.
- Kikuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with penetrating electrode
- Patent number 7,646,100
- Issue date Jan 12, 2010
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,582,971
- Issue date Sep 1, 2009
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chucking method and processing method using the same
- Patent number 7,495,881
- Issue date Feb 24, 2009
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with via hole for electric connection
- Patent number 7,485,967
- Issue date Feb 3, 2009
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a peeling prevention layer
- Patent number 7,382,037
- Issue date Jun 3, 2008
- Sanyo Electric Co., LTD
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a via hole having a diameter at the surfa...
- Patent number 7,339,273
- Issue date Mar 4, 2008
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,256,420
- Issue date Aug 14, 2007
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100044839
- Publication date Feb 25, 2010
- Sanyo Electric Co., Ltd.
- Kikuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20090315175
- Publication date Dec 24, 2009
- Sanyo Electric Co., Ltd.
- Kikuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH HOLE
- Publication number 20090124078
- Publication date May 14, 2009
- SANYO ELECTRIC CO., LTD.
- Kojiro KAMEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20080254618
- Publication date Oct 16, 2008
- SANYO ELECTRIC CO., LTD.
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20080135870
- Publication date Jun 12, 2008
- SANYO ELECTRIC CO., LTD.
- Kikuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080132038
- Publication date Jun 5, 2008
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070254471
- Publication date Nov 1, 2007
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060202348
- Publication date Sep 14, 2006
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chucking method and processing method using the same
- Publication number 20060120010
- Publication date Jun 8, 2006
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20060108691
- Publication date May 25, 2006
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20060108695
- Publication date May 25, 2006
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20060087042
- Publication date Apr 27, 2006
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060073696
- Publication date Apr 6, 2006
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method of the same
- Publication number 20060071342
- Publication date Apr 6, 2006
- Sanyo Electric Co., Ltd.
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS

Kojiro Kameyama

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device with through hole

Electrode structure and semiconductor device

Method of manufacturing a semiconductor device with a peeling preve...

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device with a barrier layer a...

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

Semiconductor device with penetrating electrode

Semiconductor device and manufacturing method of the same

Chucking method and processing method using the same

Semiconductor device with via hole for electric connection

Semiconductor device with a peeling prevention layer

Semiconductor device with a via hole having a diameter at the surfa...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRODE STRUCTURE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH HOLE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Chucking method and processing method using the same

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method of the same