Kok Chai Goh

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multi-level die block
- Patent number 9,275,944
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power single-die semiconductor package
- Patent number 9,054,063
- Issue date Jun 9, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multi-Level Die Block
- Publication number 20150061096
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Single-Die Semiconductor Package
- Publication number 20140299981
- Publication date Oct 9, 2014
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS

Kok Chai Goh

Person

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Method for producing electronic device with multi-layer contact

Bump package and methods of formation thereof

Semiconductor package with multi-level die block

Molding material and method for packaging semiconductor chips

High power single-die semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

Electronic Device with Multi-Layer Contact

Semiconductor Package with Multi-Level Die Block

Molding Material and Method for Packaging Semiconductor Chips

High Power Single-Die Semiconductor Package

Bump Package and Methods of Formation Thereof