Kok Chuen LOCK

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with integrated shielding
- Patent number 11,901,308
- Issue date Feb 13, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies electrically connected to a package substrate by lead...
- Patent number 11,227,818
- Issue date Jan 18, 2022
- UTAC HEADQUARTERS PTE. LTD.
- Wing Keung Lam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING
- Publication number 20220028798
- Publication date Jan 27, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth SIRINORAKUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210035891
- Publication date Feb 4, 2021
- UTAC Headquarters Pte. Ltd.
- Wing Keung LAM
- H01 - BASIC ELECTRIC ELEMENTS