Kok Hou TEH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an impedance-boosting channel
- Patent number 10,971,440
- Issue date Apr 6, 2021
- Intel Coropration
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20240008177
- Publication date Jan 4, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20230113084
- Publication date Apr 13, 2023
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL
- Publication number 20190181080
- Publication date Jun 13, 2019
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS