Kok Hua Chua

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and a method for dissipating heat in an...
- Patent number 8,859,333
- Issue date Oct 14, 2014
- LSI Corporation
- Kok Hua Simon Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal performance packaging for circuit dies
- Patent number 7,776,648
- Issue date Aug 17, 2010
- Agere Systems Inc.
- Kok Hua Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-in-line BGA ball mounter
- Patent number 6,412,680
- Issue date Jul 2, 2002
- Agere Systems Guardian Corp.
- Kok Hua Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated circuit using vented mold
- Patent number 6,319,450
- Issue date Nov 20, 2001
- Agere Systems Guardian Corp.
- Kok Hua Chua
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for cutting a substrate
- Patent number 6,199,464
- Issue date Mar 13, 2001
- Lucent Technologies, Inc.
- Kok Hua Chua
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR DISSIPATING HEAT IN AN...
- Publication number 20100120206
- Publication date May 13, 2010
- Agere Systems, Inc.
- Kok Hua Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Thermal Performance Packaging for Circuit Dies
- Publication number 20090001561
- Publication date Jan 1, 2009
- Kok Hua Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component package
- Publication number 20060108681
- Publication date May 25, 2006
- Kok Hua Chua
- H01 - BASIC ELECTRIC ELEMENTS