Kok Meng KAM

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Ipoh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices, and package molds for forming packa...
- Patent number 12,119,239
- Issue date Oct 15, 2024
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
- Publication number 20240105390
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Kok Meng KAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...
- Publication number 20230421119
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...
- Publication number 20230162991
- Publication date May 25, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
- Publication number 20220399318
- Publication date Dec 15, 2022
- Cree, Inc.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS