Kok Siang Goh

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Ipoh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Piping arrangement for a water purification apparatus
- Patent number 10,058,820
- Issue date Aug 28, 2018
- Chin Jin Foo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple row exposed leads for MLP high density packages
- Patent number 7,846,774
- Issue date Dec 7, 2010
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making the mould for encapsulating a leadframe package
- Patent number 7,351,611
- Issue date Apr 1, 2008
- Carsem (M) Sdn Bhd
- Richard Mow Lum Yee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PIPING ARRANGEMENT FOR A WATER PURIFICATION APPARATUS
- Publication number 20170001145
- Publication date Jan 5, 2017
- Chin Jin FOO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE
- Publication number 20160049357
- Publication date Feb 18, 2016
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
- Publication number 20090026594
- Publication date Jan 29, 2009
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES
- Publication number 20070281392
- Publication date Dec 6, 2007
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mould for encapsulating a leadframe package and method of making th...
- Publication number 20050186711
- Publication date Aug 25, 2005
- Richard Mow Lum Yee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL