Kok Sing Goh

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Ground connector in an integrated circuit testing apparatus
- Patent number 11,821,916
- Issue date Nov 21, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,696,396
- Issue date Jul 4, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,674,977
- Issue date Jun 13, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,266,015
- Issue date Mar 1, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low inductance electrical contact assembly manufacturing process
- Patent number 10,830,812
- Issue date Nov 10, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Horizontal clamp electrical contact assembly
- Patent number 10,826,217
- Issue date Nov 3, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Short contact with multifunctional elastomer
- Patent number 10,578,645
- Issue date Mar 3, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Kelvin contact assembly and method of installation thereof
- Patent number 10,527,646
- Issue date Jan 7, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Compressible layer with integrated bridge in IC testing apparatus
- Patent number 10,488,439
- Issue date Nov 26, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High precision vertical motion kelvin contact assembly
- Patent number 10,466,300
- Issue date Nov 5, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact in a testing apparatus for integrated circuits
- Patent number 10,446,965
- Issue date Oct 15, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Compressible layer with integrated bridge in IC testing apparatus
- Patent number 10,031,163
- Issue date Jul 24, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Kelvin contact assembly in a testing apparatus for integrated circuits
- Patent number 10,018,653
- Issue date Jul 10, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Short contact in a testing apparatus for wireless integrated circuits
- Patent number 10,018,652
- Issue date Jul 10, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact assembly in a testing apparatus for integrated circuits
- Patent number 9,658,253
- Issue date May 23, 2017
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Electrical interconnect assembly
- Patent number 9,140,721
- Issue date Sep 22, 2015
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Electrical interconnect assembly
- Patent number 8,952,714
- Issue date Feb 10, 2015
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD
- Publication number 20240280607
- Publication date Aug 22, 2024
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS
- Publication number 20240159796
- Publication date May 16, 2024
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR ALIGNING CONTACT PINS IN AN INTEGRATED CIRCUIT TESTING A...
- Publication number 20230314501
- Publication date Oct 5, 2023
- JF MICROTECHNOLOGY SDN. BHD.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220390488
- Publication date Dec 8, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
GROUND CONNECTOR IN AN INTEGRATED CIRCUIT TESTING APPARATUS
- Publication number 20220317152
- Publication date Oct 6, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220151063
- Publication date May 12, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20210392746
- Publication date Dec 16, 2021
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGED CONTACT FINGERS FOR INTEGRATED CIRCUIT TESTING APPARATUS
- Publication number 20200393511
- Publication date Dec 17, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
SHORT CONTACT WITH MULTIFUNCTIONAL ELASTOMER
- Publication number 20200064371
- Publication date Feb 27, 2020
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
HORIZONTAL CLAMP ELECTRICAL CONTACT ASSEMBLY
- Publication number 20190267738
- Publication date Aug 29, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY MANUFACTURING PROCESS
- Publication number 20190064260
- Publication date Feb 28, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY
- Publication number 20190067861
- Publication date Feb 28, 2019
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING PROCESS FOR KELVIN CONTACT ASSEMBLY HOUSING
- Publication number 20180337505
- Publication date Nov 22, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PRECISION VERTICAL MOTION KELVIN CONTACT ASSEMBLY
- Publication number 20180335473
- Publication date Nov 22, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
COMPRESSIBLE LAYER WITH INTEGRATED BRIDGE IN IC TESTING APPARATUS
- Publication number 20180328963
- Publication date Nov 15, 2018
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
SHORT CONTACT WITH MULTIFUNCTIONAL ELASTOMER
- Publication number 20180313869
- Publication date Nov 1, 2018
- JF MICROTECHNOLOGY SDN. BHD.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
KELVIN CONTACT ASSEMBLY AND METHOD OF INSTALLATION THEREOF
- Publication number 20170242055
- Publication date Aug 24, 2017
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS
- Publication number 20170244189
- Publication date Aug 24, 2017
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
KELVIN CONTACT ASSEMBLY IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS
- Publication number 20170219624
- Publication date Aug 3, 2017
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
CONTACT ASSEMBLY IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS
- Publication number 20160178692
- Publication date Jun 23, 2016
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
SHORT CONTACT IN A TESTING APPARATUS FOR WIRELESS INTEGRATED CIRCUITS
- Publication number 20160079707
- Publication date Mar 17, 2016
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL INTERCONNECT ASSEMBLY
- Publication number 20150212111
- Publication date Jul 30, 2015
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Application
COMPRESSIBLE LAYER WITH INTEGRATED BRIDGE IN IC TESTING APPARATUS
- Publication number 20150168451
- Publication date Jun 18, 2015
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL INTERCONNECT ASSEMBLY
- Publication number 20140127953
- Publication date May 8, 2014
- JF MICROTECHNOLOGY SDN. BHD.
- Wei Kuong Foong
- G01 - MEASURING TESTING

Kok Sing Goh

Person

Patents Grantslast 30 patents

Ground connector in an integrated circuit testing apparatus

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Low inductance electrical contact assembly manufacturing process

Horizontal clamp electrical contact assembly

Short contact with multifunctional elastomer

Kelvin contact assembly and method of installation thereof

Compressible layer with integrated bridge in IC testing apparatus

High precision vertical motion kelvin contact assembly

Spring contact in a testing apparatus for integrated circuits

Compressible layer with integrated bridge in IC testing apparatus

Kelvin contact assembly in a testing apparatus for integrated circuits

Short contact in a testing apparatus for wireless integrated circuits

Contact assembly in a testing apparatus for integrated circuits

Electrical interconnect assembly

Electrical interconnect assembly

Patents Applicationslast 30 patents

ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD

SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS

METHOD FOR ALIGNING CONTACT PINS IN AN INTEGRATED CIRCUIT TESTING A...

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

GROUND CONNECTOR IN AN INTEGRATED CIRCUIT TESTING APPARATUS

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

WEDGED CONTACT FINGERS FOR INTEGRATED CIRCUIT TESTING APPARATUS

SHORT CONTACT WITH MULTIFUNCTIONAL ELASTOMER

HORIZONTAL CLAMP ELECTRICAL CONTACT ASSEMBLY

LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY MANUFACTURING PROCESS

LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY

MANUFACTURING PROCESS FOR KELVIN CONTACT ASSEMBLY HOUSING

HIGH PRECISION VERTICAL MOTION KELVIN CONTACT ASSEMBLY

COMPRESSIBLE LAYER WITH INTEGRATED BRIDGE IN IC TESTING APPARATUS

SHORT CONTACT WITH MULTIFUNCTIONAL ELASTOMER

KELVIN CONTACT ASSEMBLY AND METHOD OF INSTALLATION THEREOF

SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS

KELVIN CONTACT ASSEMBLY IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS

CONTACT ASSEMBLY IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS

SHORT CONTACT IN A TESTING APPARATUS FOR WIRELESS INTEGRATED CIRCUITS

ELECTRICAL INTERCONNECT ASSEMBLY

COMPRESSIBLE LAYER WITH INTEGRATED BRIDGE IN IC TESTING APPARATUS

ELECTRICAL INTERCONNECT ASSEMBLY