Kok Tong Thiam

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for decapping integrated circuit packages
- Patent number 6,917,011
- Issue date Jul 12, 2005
- Advanced Micro Devices PTE Ltd.
- Ming Hui Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for decapping integrated circuit packages
- Publication number 20030010761
- Publication date Jan 16, 2003
- Ming Hui Hong
- H01 - BASIC ELECTRIC ELEMENTS