Kok Wai Mui

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Selangor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Image sensor device
- Patent number 6,900,531
- Issue date May 31, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing copper metallization die for wirebonding
- Patent number 6,693,020
- Issue date Feb 17, 2004
- Motorola, Inc.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor device
- Publication number 20040080037
- Publication date Apr 29, 2004
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip optical and imaging sensor device
- Publication number 20040065933
- Publication date Apr 8, 2004
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preparing copper metallization die for wirebonding
- Publication number 20020127825
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS