Kok Yau Chua

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip having through hole accommodating component-relat...
- Patent number 12,027,436
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with acoustic sensing device(s) and millimeter wave sensing...
- Patent number 11,039,231
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Kok Yau Chua
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electrical mechanical system sensor package and method of man...
- Patent number 10,631,100
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electrical mechanical system sensor package and method of man...
- Patent number 10,595,132
- Issue date Mar 17, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 10,501,312
- Issue date Dec 10, 2019
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,304,780
- Issue date May 28, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,163,812
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sensor device including a flip-chip mounted semiconducto...
- Patent number 10,155,657
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded cavity package with embedded conductive layer and enhanced s...
- Patent number 9,868,632
- Issue date Jan 16, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VOLTAGE REGULATOR MODULE HAVING A POWER STAGE
- Publication number 20240314926
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20240162136
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20230371165
- Publication date Nov 16, 2023
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Electrical Device Package Comprising Plat...
- Publication number 20220375883
- Publication date Nov 24, 2022
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...
- Publication number 20220254696
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING...
- Publication number 20200154183
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Kok Yau Chua
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
MICRO-ELECTRICAL MECHANICAL SYSTEM SENSOR PACKAGE AND METHOD OF MAN...
- Publication number 20200084550
- Publication date Mar 12, 2020
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
- Publication number 20200048075
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Leadframe, Semiconductor Package and Method
- Publication number 20200051898
- Publication date Feb 13, 2020
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
- Publication number 20190023561
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180308804
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180108616
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Cavity Package with Embedded Conductive Layer and Enhanced S...
- Publication number 20170275159
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC SENSOR DEVICE INCLUDING A FLIP-CHIP MOUNTED SEMICONDUCTO...
- Publication number 20170081175
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kok Yau Chua

Person

Patents Grantslast 30 patents

Voltage regulator module with inductor-cooled power stage

Package with clip having through hole accommodating component-relat...

Semiconductor package having a laser-activatable mold compound

Pressure sensor having a lidless/laminate structure

Over-under sensor packaging with sensor spaced apart from control chip

Manufacturing a package using plateable encapsulant

Package with acoustic sensing device(s) and millimeter wave sensing...

Semiconductor package with air cavity

Micro-electrical mechanical system sensor package and method of man...

Micro-electrical mechanical system sensor package and method of man...

Over-under sensor packaging with sensor spaced apart from control chip

Semiconductor package with plateable encapsulant and a method for m...

Device having substrate with conductive pillars

Device having substrate with conductive pillars

Electronic sensor device including a flip-chip mounted semiconducto...

Molded cavity package with embedded conductive layer and enhanced s...

Molded package structure with glue bleed stopper for sealing a MEMs...

Patents Applicationslast 30 patents

VOLTAGE REGULATOR MODULE HAVING A POWER STAGE

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

PACKAGE FOR A LATERAL POWER TRANSISTOR

VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE

Method for Fabricating an Electrical Device Package Comprising Plat...

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...

Pressure Sensor

Semiconductor Package Having a Laser-Activatable Mold Compound

PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING...

MICRO-ELECTRICAL MECHANICAL SYSTEM SENSOR PACKAGE AND METHOD OF MAN...

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

Leadframe, Semiconductor Package and Method

Manufacturing a package using plateable encapsulant

Semiconductor Package with Air Cavity

SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS

Molded Cavity Package with Embedded Conductive Layer and Enhanced S...

Manufacturing a package using plateable encapsulant

ELECTRONIC SENSOR DEVICE INCLUDING A FLIP-CHIP MOUNTED SEMICONDUCTO...