Koki Otake

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reflow apparatus, a reflow method, and a manufacturing method of a...
- Patent number 8,490,857
- Issue date Jul 23, 2013
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow apparatus, a reflow method, and a manufacturing method of se...
- Patent number 8,336,756
- Issue date Dec 25, 2012
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder jointing system, solder jointing method, semiconductor devic...
- Patent number 6,732,911
- Issue date May 11, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bumps
- Patent number 6,319,810
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,271,110
- Issue date Aug 7, 2001
- Fujitsu Limited
- Ichiro Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating bump forming plate member
- Patent number 6,090,301
- Issue date Jul 18, 2000
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
- Patent number 6,025,258
- Issue date Feb 15, 2000
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device, base member for semico...
- Patent number 6,022,759
- Issue date Feb 8, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the device
- Patent number 5,920,117
- Issue date Jul 6, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, base member for semiconductor device and semi...
- Patent number 5,747,874
- Issue date May 5, 1998
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming solder balls on a plate having apertures using...
- Patent number 5,643,831
- Issue date Jul 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A...
- Publication number 20120187181
- Publication date Jul 26, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow apparatus, a reflow method, and a manufacturing method of se...
- Publication number 20070099411
- Publication date May 3, 2007
- FUJITSU LIMITED
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder jointing system, solder jointing method, semiconductor devic...
- Publication number 20020130164
- Publication date Sep 19, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Reflow apparatus, a reflow method, and a manufacturing method of a...

Reflow apparatus, a reflow method, and a manufacturing method of se...

Solder jointing system, solder jointing method, semiconductor devic...

Bump-forming method using two plates and electronic device

Method for forming solder bumps

Bump-forming method using two plates and electronic device

Method for fabricating bump forming plate member

Method for fabricating solder bumps by forming solder balls with a...

Method for producing a semiconductor device, base member for semico...

Semiconductor device and method of forming the device

Semiconductor device, base member for semiconductor device and semi...

Process for forming solder balls on a plate having apertures using...

Patents Applicationslast 30 patents

REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A...

Reflow apparatus, a reflow method, and a manufacturing method of se...

Solder jointing system, solder jointing method, semiconductor devic...

Bump-forming method using two plates and electronic device