Koki TANAKA

Person

Miyagi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,368,050
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Masahiko Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,354,837
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma etching apparatus
- Patent number 12,354,853
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Koki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,347,651
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Koki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analysis device and analysis method
- Patent number 12,072,693
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Koki Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etching method and plasma etching apparatus
- Patent number 11,637,020
- Issue date Apr 25, 2023
- Tokyo Electron Limited
- Koki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,127,600
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Koki Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE ABNORMALITY DETECTION METHOD
- Publication number 20250201606
- Publication date Jun 19, 2025
- TOKYO ELECTRON LIMITED
- Ryu NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250191889
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Ryutaro SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...
- Publication number 20240412955
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Masahiko YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240071723
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Ryutaro SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, PRESSURE VAL...
- Publication number 20230395360
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Kota SHIHOMMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING FOR SEMICONDUCTOR FABRICATION
- Publication number 20230307242
- Publication date Sep 28, 2023
- TOKYO ELECTRON LIMITED
- Yu-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230282447
- Publication date Sep 7, 2023
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA ETCHING APPARATUS
- Publication number 20230245897
- Publication date Aug 3, 2023
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230170189
- Publication date Jun 1, 2023
- TOKYO ELECTRON LIMITED
- Takashi KAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PATTERN
- Publication number 20230130385
- Publication date Apr 27, 2023
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, INFORMATION PROCESSING APPARATUS, AND...
- Publication number 20230115942
- Publication date Apr 13, 2023
- TOKYO ELECTRON LIMITED
- Shuhei AKAHANE
- G05 - CONTROLLING REGULATING
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230100292
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- KYURI MOTOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA ETCHING APPARATUS
- Publication number 20230069553
- Publication date Mar 2, 2023
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230035021
- Publication date Feb 2, 2023
- TOKYO ELECTRON LIMITED
- Masahiko YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220093367
- Publication date Mar 24, 2022
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYSIS DEVICE, PLASMA PROCESS CONTROL SYSTEM, AND RECORDING MEDIUM
- Publication number 20220075358
- Publication date Mar 10, 2022
- TOKYO ELECTRON LIMITED
- Ryu NAGAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETCHING METHOD AND PLASMA ETCHING APPARATUS
- Publication number 20220051902
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20210398819
- Publication date Dec 23, 2021
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANALYSIS DEVICE AND ANALYSIS METHOD
- Publication number 20210312610
- Publication date Oct 7, 2021
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETCHING METHOD
- Publication number 20200263309
- Publication date Aug 20, 2020
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Koki TANAKA

Person

Patents Grantslast 30 patents

Plasma processing method and plasma processing apparatus

Plasma processing method and plasma processing apparatus

Etching method and plasma etching apparatus

Etching method and plasma processing apparatus

Analysis device and analysis method

Etching method and plasma etching apparatus

Etching method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE ABNORMALITY DETECTION METHOD

PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, PRESSURE VAL...

METHOD FOR ETCHING FOR SEMICONDUCTOR FABRICATION

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA ETCHING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

METHOD FOR FORMING A PATTERN

SUBSTRATE PROCESSING SYSTEM, INFORMATION PROCESSING APPARATUS, AND...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA ETCHING APPARATUS

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ANALYSIS DEVICE, PLASMA PROCESS CONTROL SYSTEM, AND RECORDING MEDIUM

ETCHING METHOD AND PLASMA ETCHING APPARATUS

ETCHING METHOD

ANALYSIS DEVICE AND ANALYSIS METHOD

ETCHING METHOD