Kokichi Minato

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 10,950,504
- Issue date Mar 16, 2021
- Disco Corporation
- Zach Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting apparatus and wafer processing method
- Patent number 10,622,215
- Issue date Apr 14, 2020
- Disco Corporation
- Atsushi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20250239443
- Publication date Jul 24, 2025
- Disco Corporation
- Kokichi MINATO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PROCESSING LAMINATED WAFER
- Publication number 20250149341
- Publication date May 8, 2025
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20250029828
- Publication date Jan 23, 2025
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND EDGE TRIMMING APPARATUS
- Publication number 20240429087
- Publication date Dec 26, 2024
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE TRIMMING APPARATUS
- Publication number 20210043473
- Publication date Feb 11, 2021
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200176316
- Publication date Jun 4, 2020
- Disco Corporation
- Zach POWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20190051532
- Publication date Feb 14, 2019
- Disco Corporation
- Atsushi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS