Kon Hoe Chin

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS