Konatsu Nakamura

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Support-provided insulating layer, laminate, and wiring board
- Patent number 11,319,457
- Issue date May 3, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaki Morita
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...
- Publication number 20190218415
- Publication date Jul 18, 2019
- Hitachi Chemical Company, Ltd.
- Masaki MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...
- Publication number 20130199830
- Publication date Aug 8, 2013
- Hitachi Chemical Company Ltd.
- Masaki Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...