Kong-Beng Thei

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and related apparatus for reducing gate-induced drain leakag...
- Patent number 12,211,926
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thicker corner of a gate dielectric structure around a recessed gat...
- Patent number 12,191,365
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transistor device with a gate structure having...
- Patent number 12,176,407
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 12,100,706
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing device and method of operating the same
- Patent number 12,050,245
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 12,021,140
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,002,807
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate for an MV device
- Patent number 11,948,938
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer to reduce bond pad necking and/or redistribution la...
- Patent number 11,862,592
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary design for high-voltage integration on HKMG technology
- Patent number 11,855,091
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FUSI gated device formation
- Patent number 11,823,959
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 11,810,973
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thicker corner of a gate dielectric structure around a recessed gat...
- Patent number 11,799,007
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,710,712
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,705,449
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 11,677,022
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,646,308
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,626,398
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention dummy structures for semiconductor devices
- Patent number 11,569,363
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate for an MV device
- Patent number 11,527,531
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer to reduce bond pad necking and/or redistribution la...
- Patent number 11,476,214
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thicker corner of a gate dielectric structure around a recessed gat...
- Patent number 11,469,307
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device with a gate structure having recesses overlying a...
- Patent number 11,444,169
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,417,649
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary design for high-voltage integration on HKMG technology
- Patent number 11,410,999
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 11,410,995
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,367,721
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 11,302,691
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed composite capacitor
- Patent number 11,276,684
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR DEVICE WITH RECESSED GATE STRUCTURE
- Publication number 20240379789
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...
- Publication number 20240379788
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371865
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20240353474
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng THEI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240313111
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240297171
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-JUNG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY
- Publication number 20240186235
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED GATE FOR AN MV DEVICE
- Publication number 20240186320
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240088096
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY
- Publication number 20240088154
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240030340
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
- Publication number 20230420392
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSI GATED DEVICE FORMATION
- Publication number 20230377992
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...
- Publication number 20230361188
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE AND METHOD FOR USING THE SAME
- Publication number 20230343653
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317656
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20230268435
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230243885
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng THEI
- G01 - MEASURING TESTING
Information Patent Application
TRANSISTOR DEVICE WITH RECESSED GATE STRUCTURE
- Publication number 20220367655
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220367452
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220367709
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...
- Publication number 20220367654
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220367708
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL SPACER TO REDUCE BOND PAD NECKING AND/OR REDISTRIBUTION LA...
- Publication number 20220359443
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20220359502
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220352044
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-JIER FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY
- Publication number 20220352161
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED GATE FOR AN MV DEVICE
- Publication number 20220352152
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220320082
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-JUNG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20220302108
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS

Kong-Beng Thei

Person

Patents Grantslast 30 patents

Method and related apparatus for reducing gate-induced drain leakag...

Thicker corner of a gate dielectric structure around a recessed gat...

Method of forming a transistor device with a gate structure having...

Semiconductor structure and method of forming thereof

Semiconductor testing device and method of operating the same

Semiconductor structure and method of forming thereof

Semiconductor structure

Recessed gate for an MV device

Sidewall spacer to reduce bond pad necking and/or redistribution la...

Boundary design for high-voltage integration on HKMG technology

FUSI gated device formation

Semiconductor structure and method of forming thereof

Thicker corner of a gate dielectric structure around a recessed gat...

Semiconductor device and manufacturing method of the same

Through silicon via design for stacking integrated circuits

Semiconductor structure and method of forming thereof

Through silicon via design for stacking integrated circuits

Semiconductor structure and method for manufacturing thereof

Dishing prevention dummy structures for semiconductor devices

Recessed gate for an MV device

Sidewall spacer to reduce bond pad necking and/or redistribution la...

Thicker corner of a gate dielectric structure around a recessed gat...

Transistor device with a gate structure having recesses overlying a...

Semiconductor device

Boundary design for high-voltage integration on HKMG technology

Semiconductor structure and method of forming thereof

Semiconductor structure

Film scheme for bumping

High voltage integration for HKMG technology

Recessed composite capacitor

Patents Applicationslast 30 patents

TRANSISTOR DEVICE WITH RECESSED GATE STRUCTURE

THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY

RECESSED GATE FOR AN MV DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING

FUSI GATED DEVICE FORMATION

THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...

TESTING MODULE AND METHOD FOR USING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME

TRANSISTOR DEVICE WITH RECESSED GATE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

THICKER CORNER OF A GATE DIELECTRIC STRUCTURE AROUND A RECESSED GAT...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

SIDEWALL SPACER TO REDUCE BOND PAD NECKING AND/OR REDISTRIBUTION LA...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY

RECESSED GATE FOR AN MV DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS