Kong-Toon Ng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 11,709,327
- Issue date Jul 25, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,676,948
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,418,002
- Issue date Aug 16, 2022
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,289,346
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,164,755
- Issue date Nov 2, 2021
- Siliconware Precision Industries Co., Ltd.
- Yung-Ta Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,056,470
- Issue date Jul 6, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 10,741,500
- Issue date Aug 11, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240019649
- Publication date Jan 18, 2024
- ADVANCED MICRO DEVICES, INC.
- BRETT P. WILKERSON
- G02 - OPTICS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20230268328
- Publication date Aug 24, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE
- Publication number 20230187364
- Publication date Jun 15, 2023
- ADVANCED MICRO DEVICES, INC.
- Chia-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20220342165
- Publication date Oct 27, 2022
- ADVANCED MICRO DEVICES, INC.
- BRETT P. WILKERSON
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210343546
- Publication date Nov 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Yung-Ta Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210296295
- Publication date Sep 23, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210066883
- Publication date Mar 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200402965
- Publication date Dec 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200335447
- Publication date Oct 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190237374
- Publication date Aug 1, 2019
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Kong-Toon Ng

Person

Patents Grantslast 30 patents

Fanout module integrating a photonic integrated circuit

Method for fabricating electronic package

Electronic package and method for fabricating the same

Method for fabricating electronic package

Electronic package and method for fabricating the same

Electronic package and method for fabricating the same

Electronic package

Patents Applicationslast 30 patents

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

METHOD FOR FABRICATING ELECTRONIC PACKAGE

SEMICONDUCTOR CHIP DEVICE

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME