Kong Weng Lee

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a packaging device for semiconductor die and...
- Patent number 7,279,355
- Issue date Oct 9, 2007
- Avago Technologies ECBUIP (Singapore) Pte Ltd
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device for semiconductor die, semiconductor device incorp...
- Patent number 7,256,486
- Issue date Aug 14, 2007
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ceramic packaging for high brightness LED devices
- Publication number 20080025030
- Publication date Jan 31, 2008
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic packaging for high brightness LED devices
- Publication number 20050213334
- Publication date Sep 29, 2005
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging device for semiconductor die, semiconductor device incorp...
- Publication number 20040262738
- Publication date Dec 30, 2004
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a packaging device for semiconductor die and...
- Publication number 20040266058
- Publication date Dec 30, 2004
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS