Konomu Ohki

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Gunma-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing substrate to achieve semiconductor integrated...
- Patent number 5,686,364
- Issue date Nov 11, 1997
- Shin-Etsu Handotai Co., Ltd.
- Konomu Ohki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectrically isolated substrate and a process for producing the same
- Patent number 5,336,634
- Issue date Aug 9, 1994
- Shin-Etsu Handotui Co., Ltd.
- Masatake Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI substrate with uniform thin silicon film
- Patent number 5,240,883
- Issue date Aug 31, 1993
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of dielectric-separation substrate
- Patent number 5,183,783
- Issue date Feb 2, 1993
- Shin-Etsu Handotai Co., Ltd.
- Yutaka Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of dielectric-separation substrate
- Patent number 5,124,274
- Issue date Jun 23, 1992
- Shin-Etsu Handotai Co., Ltd.
- Konomu Ohki
- H01 - BASIC ELECTRIC ELEMENTS