Koo Woong Jeong

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,715,680
- Issue date Aug 1, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-embedded substrate
- Patent number 11,439,021
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING TH...
- Publication number 20230108464
- Publication date Apr 6, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED BOARD
- Publication number 20220208629
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220199506
- Publication date Jun 23, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20220007511
- Publication date Jan 6, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS