Kook-jin OH

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device package and method of manufacturing the same
- Patent number 8,829,691
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- Jae-yun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring semiconductor chip
- Patent number 7,793,408
- Issue date Sep 14, 2010
- Samsung Electronics Co., Ltd.
- Kook-Jin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for automated wire bonding
- Patent number 7,631,795
- Issue date Dec 15, 2009
- Samsung Electronics Co., Ltd.
- Byung-Soo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for clamping a wire
- Patent number 7,481,351
- Issue date Jan 27, 2009
- Samsung Electronics Co., Ltd.
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND PHOSPHOR-CONTAINI...
- Publication number 20130177998
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Jee Hun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175665
- Publication date Jul 12, 2012
- SAMSUNG LED Co., Ltd.
- Jae-yun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING SEMICONDUCTOR CHIP AND METHOD OF TRANSFE...
- Publication number 20080148558
- Publication date Jun 26, 2008
- Samsung Electronics Co., Ltd.
- Kook-Jin OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for wire bonding and die attaching
- Publication number 20050269713
- Publication date Dec 8, 2005
- Kook-Jin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for automated wire bonding
- Publication number 20050173491
- Publication date Aug 11, 2005
- Byung-Soo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus and method for clamping a wire
- Publication number 20050133563
- Publication date Jun 23, 2005
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Snap cure device for semiconductor chip attachment
- Publication number 20050126696
- Publication date Jun 16, 2005
- Kook-Jin Oh
- H01 - BASIC ELECTRIC ELEMENTS

Kook-jin OH

Person

Patents Grantslast 30 patents

Light-emitting device package and method of manufacturing the same

Apparatus for transferring semiconductor chip

System and method for automated wire bonding

Wire bonding apparatus and method for clamping a wire

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND PHOSPHOR-CONTAINI...

LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

APPARATUS FOR TRANSFERRING SEMICONDUCTOR CHIP AND METHOD OF TRANSFE...

Apparatus and method for wire bonding and die attaching

System and method for automated wire bonding

Wire bonding apparatus and method for clamping a wire

Snap cure device for semiconductor chip attachment