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Korbinian KASPAR
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Regensburg, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Methods for forming a semiconductor device and semiconductor devices
Patent number
10,727,126
Issue date
Jul 28, 2020
Infineon Technologies AG
Korbinian Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dicing a wafer and semiconductor chip
Patent number
9,911,655
Issue date
Mar 6, 2018
Infineon Technologies AG
Markus Brunnbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a semiconductor substrate and semiconductor chip
Patent number
9,831,127
Issue date
Nov 28, 2017
Infineon Technologies AG
Franco Mariani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dicing a wafer and semiconductor chip
Patent number
9,570,352
Issue date
Feb 14, 2017
Infineon Technologies AG
Markus Brunnbauer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Methods for Forming a Semiconductor Device and Semiconductor Devices
Publication number
20170345717
Publication date
Nov 30, 2017
INFINEON TECHNOLOGIES AG
Korbinian Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
Publication number
20170110371
Publication date
Apr 20, 2017
INFINEON TECHNOLOGIES AG
Markus BRUNNBAUER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
Publication number
20160211178
Publication date
Jul 21, 2016
INFINEON TECHNOLOGIES AG
Markus BRUNNBAUER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Including a Protection Structure
Publication number
20160211227
Publication date
Jul 21, 2016
INFINEON TECHNOLOGIES AG
Eva Wagner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP
Publication number
20160211179
Publication date
Jul 21, 2016
INFINEON TECHNOLOGIES AG
Franco Mariani
H01 - BASIC ELECTRIC ELEMENTS