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Korehide Okamoto

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  • Fukuoka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device including surface pressure absorbing member fo...
    • Patent number 12,191,218
    • Issue date Jan 7, 2025
    • Mitsubishi Electric Corporation
    • Arata Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 11,961,784
    • Issue date Apr 16, 2024
    • Mitsubishi Electric Corporation
    • Arata Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Mold device
    • Patent number 10,682,792
    • Issue date Jun 16, 2020
    • Mitsubishi Electric Corporation
    • Takatoshi Yasui
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Semiconductor device module
    • Patent number 10,510,642
    • Issue date Dec 17, 2019
    • Mitsubishi Electric Corporation
    • Arata Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,049,960
    • Issue date Aug 14, 2018
    • Mitsubishi Electric Corporation
    • Ryoji Murai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module
    • Patent number 8,749,047
    • Issue date Jun 10, 2014
    • Mitsubishi Electric Corporation
    • Shintaro Araki
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Power module
    • Patent number 8,710,646
    • Issue date Apr 29, 2014
    • Mitsubishi Electric Corporation
    • Shintaro Araki
  • Information Patent Grant

    Power semiconductor device
    • Patent number 6,762,491
    • Issue date Jul 13, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Shinji Hatae
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230163106
    • Publication date May 25, 2023
    • Mitsubishi Electric Corporation
    • Ryoya SHIRAHAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220059432
    • Publication date Feb 24, 2022
    • Mitsubishi Electric Corporation
    • Arata IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210202330
    • Publication date Jul 1, 2021
    • Mitsubishi Electric Corporation
    • Arata IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE MODULE
    • Publication number 20190131213
    • Publication date May 2, 2019
    • Mitsubishi Electric Corporation
    • Arata IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLD DEVICE
    • Publication number 20180147758
    • Publication date May 31, 2018
    • Mitsubishi Electric Corporation
    • Takatoshi YASUI
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20160276245
    • Publication date Sep 22, 2016
    • Mitsubishi Electric Corporation
    • Ryoji MURAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20120228741
    • Publication date Sep 13, 2012
    • MITSUBISHI ELECTRIC CORPORATION
    • Shintaro ARAKI
    • H01 - BASIC ELECTRIC ELEMENTS