Kosuke Doi

Person

  • Kanagawa, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate attaching method

    • Patent number 7,268,061
    • Issue date Sep 11, 2007
    • Tokyo Ohka Kogyo Co., Ltd.
    • Atsushi Miyanari
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Substrate attaching method

    • Publication number 20050170612
    • Publication date Aug 4, 2005
    • Tokyo Ohka Kogyo Co., Ltd.
    • Atsushi Miyanari
    • H01 - BASIC ELECTRIC ELEMENTS