Kosuke MIYOSHI

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with bonding wire and method for making the same
- Patent number 8,847,410
- Issue date Sep 30, 2014
- Rohm Co., Ltd.
- Kosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20130049231
- Publication date Feb 28, 2013
- ROHM CO., LTD.
- Kosuke MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS