Kosuke Morita

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealant sheet
- Patent number 11,891,506
- Issue date Feb 6, 2024
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing sheet with separators on both surfaces, and method for manu...
- Patent number 10,128,131
- Issue date Nov 13, 2018
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for sealing and method for manufacturing semiconductor device...
- Patent number 9,754,894
- Issue date Sep 5, 2017
- Nitto Denko Corporation
- Chie Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing sheet and method for producing secondary mounted semico...
- Patent number 9,472,439
- Issue date Oct 18, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,368,421
- Issue date Jun 14, 2016
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,085,685
- Issue date Jul 21, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,906,746
- Issue date Dec 9, 2014
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,580,619
- Issue date Nov 12, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE AND USE THEREOF
- Publication number 20250034433
- Publication date Jan 30, 2025
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RAW MATERIAL, FILM PACKAGE, AND CONTAINER
- Publication number 20240391672
- Publication date Nov 28, 2024
- FUJI SEAL INTERNATIONAL, INC.
- Akira MIYAZAKI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEALANT SHEET
- Publication number 20240191114
- Publication date Jun 13, 2024
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATE
- Publication number 20230054230
- Publication date Feb 23, 2023
- NITTO DENKO CORPORATION
- Kosuke MORITA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING METHOD
- Publication number 20230037303
- Publication date Feb 9, 2023
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RELEASE-LINERED SEALANT SHEET
- Publication number 20230040609
- Publication date Feb 9, 2023
- Nitto Denko Corporation
- Kosuke MORITA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALANT SHEET
- Publication number 20210122956
- Publication date Apr 29, 2021
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALANT SHEET
- Publication number 20210122958
- Publication date Apr 29, 2021
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALANT SHEET
- Publication number 20200291184
- Publication date Sep 17, 2020
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MASKING SHEET FOR ANODIZING
- Publication number 20170306185
- Publication date Oct 26, 2017
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASKING SHEET FOR CHEMICAL SOLUTION TREATMENT
- Publication number 20170292042
- Publication date Oct 12, 2017
- NITTO DENKO CORPORATION
- Kosuke MORITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20170125373
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...
- Publication number 20170040187
- Publication date Feb 9, 2017
- Nitto Denko Corporation
- Chie Iino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...
- Publication number 20170040287
- Publication date Feb 9, 2017
- NITTO DENKO CORPORATION
- Goji Shiga
- B32 - LAYERED PRODUCTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170032979
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...
- Publication number 20160300733
- Publication date Oct 13, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20160211217
- Publication date Jul 21, 2016
- NITTO DENKO CORPORATION
- Chie IINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...
- Publication number 20160075871
- Publication date Mar 17, 2016
- NITTO DENKO CORPORATION
- Kosuke MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-FILL MATERIAL, SEALING SHEET, AND METHOD FOR PRODUCING SEMICO...
- Publication number 20160064297
- Publication date Mar 3, 2016
- Nitto Denko Corporation
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...
- Publication number 20160056123
- Publication date Feb 25, 2016
- Nitto Denko Corporation
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...
- Publication number 20160040045
- Publication date Feb 11, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...
- Publication number 20160042986
- Publication date Feb 11, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...
- Publication number 20160035640
- Publication date Feb 4, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...
- Publication number 20160013089
- Publication date Jan 14, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...
- Publication number 20150380277
- Publication date Dec 31, 2015
- NITTO DENKO CORPORATION
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
Under-Fill Material and Method for Producing Semiconductor Device
- Publication number 20150270188
- Publication date Sep 24, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130288428
- Publication date Oct 31, 2013
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS

Kosuke Morita

Person

Patents Grantslast 30 patents

Sealant sheet

Sealing sheet with separators on both surfaces, and method for manu...

Sheet for sealing and method for manufacturing semiconductor device...

Thermally curable resin sheet for sealing semiconductor chip, and m...

Reinforcing sheet and method for producing secondary mounted semico...

Under-fill material and method for producing semiconductor device

Under-fill material and method for producing semiconductor device

Method for producing semiconductor device

Method for producing semiconductor device

Patents Applicationslast 30 patents

PRESSURE-SENSITIVE ADHESIVE TAPE AND USE THEREOF

RAW MATERIAL, FILM PACKAGE, AND CONTAINER

SEALANT SHEET

LAMINATE

SEALING METHOD

RELEASE-LINERED SEALANT SHEET

SEALANT SHEET

SEALANT SHEET

SEALANT SHEET

MASKING SHEET FOR ANODIZING

MASKING SHEET FOR CHEMICAL SOLUTION TREATMENT

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...

ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...

UNDER-FILL MATERIAL, SEALING SHEET, AND METHOD FOR PRODUCING SEMICO...

SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...

ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...

REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...

UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...

SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...

UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...

Under-Fill Material and Method for Producing Semiconductor Device

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE