Kosuke Nakano

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chip electronic component
- Patent number 12,266,473
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component
- Patent number 11,688,555
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 11,170,937
- Issue date Nov 9, 2021
- Murata Manufacturing Co., Ltd.
- Shogo Kanbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repair method and repair material
- Patent number 10,994,366
- Issue date May 4, 2021
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip electronic component
- Patent number 10,971,301
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive material, bonding method using the same, and bonded stru...
- Patent number 10,050,355
- Issue date Aug 14, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and method for forming joint structure of electroni...
- Patent number 9,691,546
- Issue date Jun 27, 2017
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,614,295
- Issue date Apr 4, 2017
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part
- Patent number 9,412,517
- Issue date Aug 9, 2016
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method, method for producing electronic device and electron...
- Patent number 9,409,247
- Issue date Aug 9, 2016
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part
- Patent number 9,368,279
- Issue date Jun 14, 2016
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method, joint structure and method for producing the same
- Patent number 9,333,593
- Issue date May 10, 2016
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,209,527
- Issue date Dec 8, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,204,541
- Issue date Dec 1, 2015
- MURATA MANUFACTURING CO., LTD.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and solder joint
- Patent number 9,162,324
- Issue date Oct 20, 2015
- Senju Metal Industry Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing the same
- Patent number 9,113,571
- Issue date Aug 18, 2015
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure
- Patent number 9,105,987
- Issue date Aug 11, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and electronic device
- Patent number 8,920,580
- Issue date Dec 30, 2014
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste and its use
- Patent number 8,227,536
- Issue date Jul 24, 2012
- Senju Metal Industry Co., Ltd.
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material and electronic apparatus
- Patent number 8,222,751
- Issue date Jul 17, 2012
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroconductive bonding material and electronic apparatus
- Patent number 8,105,687
- Issue date Jan 31, 2012
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20230274881
- Publication date Aug 31, 2023
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20210118614
- Publication date Apr 22, 2021
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20190355522
- Publication date Nov 21, 2019
- Murata Manufacturing Co., Ltd.
- Shogo KANBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20190287719
- Publication date Sep 19, 2019
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR METHOD AND REPAIR MATERIAL
- Publication number 20180369951
- Publication date Dec 27, 2018
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR JOINING STRUCTURAL MATERIAL, JOINING SHEET, AND JOINT ST...
- Publication number 20160297029
- Publication date Oct 13, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi Ishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR METHOD AND REPAIR MATERIAL
- Publication number 20160288245
- Publication date Oct 6, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi lshino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANU...
- Publication number 20160043480
- Publication date Feb 11, 2016
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE
- Publication number 20150239069
- Publication date Aug 27, 2015
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART AND METHOD FOR FORMING JOINT STRUCTURE OF ELECTRONI...
- Publication number 20150034701
- Publication date Feb 5, 2015
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140363221
- Publication date Dec 11, 2014
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140356055
- Publication date Dec 4, 2014
- Kosuke Nakano
- C21 - METALLURGY OF IRON
Information Patent Application
JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...
- Publication number 20140345939
- Publication date Nov 27, 2014
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic Part
- Publication number 20140340816
- Publication date Nov 20, 2014
- Hidekiyo Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...
- Publication number 20140193650
- Publication date Jul 10, 2014
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...
- Publication number 20140178703
- Publication date Jun 26, 2014
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130343023
- Publication date Dec 26, 2013
- Hideo NAKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...
- Publication number 20130299236
- Publication date Nov 14, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130299219
- Publication date Nov 14, 2013
- Shunsuke Chisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Structure
- Publication number 20130270001
- Publication date Oct 17, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRU...
- Publication number 20130233618
- Publication date Sep 12, 2013
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electronic Apparatus
- Publication number 20110067912
- Publication date Mar 24, 2011
- Murata Manufacturing Co., Ltd.
- Akhiro Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Lead-Free Solder Paste and Its Use
- Publication number 20100035072
- Publication date Feb 11, 2010
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste and Solder Joint
- Publication number 20090301607
- Publication date Dec 10, 2009
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electronic Apparatus
- Publication number 20090155608
- Publication date Jun 18, 2009
- Murata Manufacturing Co., Ltd.
- Akihiro Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Solder paste and electronic device
- Publication number 20070245852
- Publication date Oct 25, 2007
- Murata Manufacturing Co., Ltd.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kosuke Nakano

Person

Patents Grantslast 30 patents

Chip electronic component

Chip electronic component

Multilayer ceramic electronic component

Repair method and repair material

Chip electronic component

Conductive material, bonding method using the same, and bonded stru...

Solder paste, joining method using the same and joined structure

Electronic part and method for forming joint structure of electroni...

Joining method, joint structure, electronic device, method for manu...

Electronic part

Joining method, method for producing electronic device and electron...

Electronic part

Joining method, joint structure and method for producing the same

Joining method, joint structure, electronic device, method for manu...

Multilayer circuit board and method for manufacturing the same

Solder paste and solder joint

Electronic component module and method for manufacturing the same

Connection structure

Solder paste, joining method using the same and joined structure

Solder paste and electronic device

Lead-free solder paste and its use

Electroconductive bonding material and electronic apparatus

Electroconductive bonding material and electronic apparatus

Patents Applicationslast 30 patents

CHIP ELECTRONIC COMPONENT

CHIP ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

CHIP ELECTRONIC COMPONENT

REPAIR METHOD AND REPAIR MATERIAL

METHOD FOR JOINING STRUCTURAL MATERIAL, JOINING SHEET, AND JOINT ST...

REPAIR METHOD AND REPAIR MATERIAL

JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANU...

SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE

ELECTRONIC PART AND METHOD FOR FORMING JOINT STRUCTURE OF ELECTRONI...

JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME

JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME

JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...

Electronic Part

ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...

ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION ST...

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME

JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Connection Structure

CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRU...

Solder Paste, Joining Method Using the Same and Joined Structure

Electroconductive Bonding Material and Electronic Apparatus

Lead-Free Solder Paste and Its Use

Solder Paste and Solder Joint

Electroconductive Bonding Material and Electronic Apparatus

Solder paste and electronic device